Overview
Features
- High-performance and power-efficient Qualcomm® QCS6490 SoC
- A combined AI performance of up to 12 TOPS
- Advanced ISPs for single or multiple concurrent camera experience with superior image and video capture
- Blazing-fast wireless connectivity and low latency thanks to multi-gigabit Wi-Fi 6E: Up to 3.6 Gbps, 160MHz, 4K QAM, DBS with MU-MIMO and OFDMA, and WPA3-P & E
- Superior Bluetooth® 5.2 and LE audio with crystal-clear sound, low latency, and reliability with an extended range
- Low-speed expansion for GPIOs, I2C, SPI, UART, and/or audio
- High-speed expansion for PCIe, USB, MIPI CSI/DSI, and/or SDIO.
Target Applications
- Face Detection and Recognition
- Deep Learning
- Inventory Management
- Surveillance and Security
- Object Detection and Avoidance
- Path Planning and 3D Map Formation
- vSLAM (Visual Localization and Mapping)
- Driver Management Systems
- Industrial Handheld and Tablet
- Point-of-sale Systems (POS) and Kiosk
- Industrial PC
Specifications
| Description | |
|---|---|
| Chipset | QCS6490 |
| Processor | Qualcomm® Kryo™ CPU 670, 1x Gold+@2.7 GHz + 3x Gold@2.4 GHz + 4x Silver @1.9 GHz, 2MB L3 |
| Memory (RAM) | 8GB LPDDR4x |
| Storage (onboard) | 128GB UFS Flash |
| Storage (external) | 1x MicroSD Card Slot, PCIe expansion for NVMe |
| AI Engine | 6th Gen Qualcomm AI Engine. Unlocking a combined AI performance of up to 12 TOPS/INT8 |
| GPU/VPU/DPU | Qualcomm® Adreno™ GPU 643 Adreno 633 VPU Adreno DPU 1075 |
| DSP | Qualcomm® Compute Hexagon™ DSP with dual HVX, Hexagon Co-processor (Hexagon CP) 2.0 and Hexagon Tensor Accelerator |
| ISP | Qualcomm® Spectra™ 570L image processing |
| Camera | 2x C-PHY/D-PHY 30-pin expansion ports on interposer board |
| Video | 4K@60FPS decode H.264/H.265/VP9 4K@30FPS encode H.264/H.265 |
| Display Interfaces | Up to two displays supported concurrently: Full-size HDMI connector, USB Type-C supporting DP alt mode, mini-DP connector, DSI expansion |
| WLAN/BT | 802.11ax with DBS, Bluetooth 5.2, two onboard printed antennas, RF expansion connectors for optional external antennas |
| PCIE | 1x PCIe Gen 3 2-lane to expansion connector, optional 1x PCIe Gen 3 1-lane to expansion connector |
| USB | 1x USB 3.0 Type-C, 1x USB 2.0 w/OTG, 2x USB 3.0 Type-A, 1x USB 3.0 on high-speed expansion |
| Audio | 1x DMIC, 2x digital audio amplifiers, I2S/Soundwire/DMIC expansion on low-speed connectors |
Resources
Documents
| Resources | Description | Link |
|---|---|---|
| Quick Start Guide | ||
Related Parts
SOM
| Part Number | Name | Description | Link |
|---|---|---|---|
 |
COREXOM R6490WGQ SOM | COREXOM R6490WGQ SOM, LGA, 8GB LPDDR4, 128GB UFS, WIFI 6E, BT, GPS | Link |
Development Kits
| Part Number | Name | Description | Link |
|---|---|---|---|
 |
Qualcomm® RB3 Gen 2 Development Kit (Vision Kit) | The Vision kit includes everything in the Core kit plus the Qualcomm Vision mezzanine board, a high-resolution main camera, and a low-resolution tracking camera. | Link |
Related products
System on Module (SOM)
COREXOM R5430WGQ SOM
Presenting the COREXOM R5430WGQ SOM – powered by the Qualcomm® QCS5430 system-on-chip. Featuring the potent Qualcomm® Kryo™ 670 CPU and a fused AI-accelerator architecture within the Qualcomm® Hexagon processor, this solution impressively combines exceptional computational power with remarkable energy efficiency. Boasting support for up to five MIPI CSI interfaces, dynamic triple ISPs, seamless 4K@60FPS video decoding, and 4K@30FPS video encoding, as well as a comprehensive array of external interfaces like GPIO, UART, I2C, I3C, SPI, DSI, USB 3.1, and PCIe, the R5430WGQ SOM has been enhanced to include GPS and Wi-Fi 6E/Bluetooth features.
Furthermore, it supports Android, Ubuntu, and Linux operating systems. This System-on-Chip is designed for developers aiming to reduce design complexity and achieve a faster time to market, making it an ideal choice for industrial and commercial IoT applications. From ruggedized handhelds and tablets to kiosks, AI cameras, and point-of-sale systems, the COREXOM R5430WGQ SOM provides a comprehensive solution that empowers developers to streamline their designs and bring innovative products to market efficiently.
Wireless Module
COREXOM I9074L Long Range WIFI Module
The CRI I9074L is a high-performance M.2 module providing Wi-Fi 6 connectivity for long-range communication on both 2.4GHz and 5GHz bands. It is ideal for applications requiring reliable wireless communication over extended distances (>10km), such as robotics, drones, and IoT deployments, ensuring robust performance in demanding environments.
The module integrates seamlessly with CRI’s R5165C SOM (Qualcomm QRB5165) via a PCIe M.2 E-Key interface. The driver is specifically designed for the QRB5165 and is fully compatible with the CRI R5165C SOM.
System on Module (SOM)
COREXOM R405LQ Long Range WIFI Module
The CRI R405LQ Long Range WiFi Module is a WiFi 6 connectivity solution designed for long-range communication on both the 2.4GHz and 5GHz frequency bands. Ideal for applications requiring reliable wireless communication over extended distances (>10Km), such as robotics, drones, and IoT deployments, the R405LQ ensures robust performance in demanding environments.
This module seamlessly integrates with host controllers via USB interfaces and functions similarly to an external WiFi network module. It supports the USB RNDIS (Remote Network Driver Interface Specification) standard, providing straightforward and reliable module interface control.
SOM Development Kits
Qualcomm® RB3 Gen 2 Development Kit (Vision Kit)
The Qualcomm® RB3 Gen 2 development kit (Vision Kit) gives developers a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases such as Robotics, industrial, and automation.
▪️Backorder available. ▪️Estimated shipping: End of December.