SOM Development Kits
Qualcomm® RB3 Gen 2 Development Kit (Core Kit)
The Qualcomm® RB3 Gen 2 development kit (Core Kit) gives developers a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases such as Robotics, industrial, and automation.
SOM Development Kits
Qualcomm® RB3 Gen 2 Development Kit (Vision Kit)
The Qualcomm® RB3 Gen 2 development kit (Vision Kit) gives developers a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases such as Robotics, industrial, and automation.
System on Module (SOM)
COREXOM R6490WGQ SOM
Presenting the COREXOM R6490WGQ SOM – powered by the Qualcomm® QCS6490 system-on-chip. Featuring the potent Qualcomm® Kryo™ 670 CPU and a fused AI-accelerator architecture within the Qualcomm® Hexagon processor, this solution impressively combines exceptional computational power with remarkable energy efficiency. Boasting support for up to five MIPI CSI interfaces, dynamic triple ISPs, seamless 4K@60FPS video decoding, and 4K@30FPS video encoding, as well as a comprehensive array of external interfaces like GPIO, UART, I2C, I3C, SPI, DSI, USB 3.1, and PCIe, the R6490WGQ SOM has been enhanced to include GPS and Wi-Fi 6E/Bluetooth features.
Furthermore, it supports Android, Ubuntu, Linux, and Windows 11 IoT Enterprise operating systems. This System-on-Chip is designed for developers aiming to reduce design complexity and achieve a faster time to market, making it an ideal choice for industrial and commercial IoT applications. From ruggedized handhelds and tablets to kiosks, AI cameras, and point-of-sale systems, the COREXOM R6490WGQ SOM provides a comprehensive solution that empowers developers to streamline their designs and bring innovative products to market efficiently.
Wireless Module
COREXOM I9074L Long Range WIFI Module
The CRI I9074L is a high-performance M.2 module providing Wi-Fi 6 connectivity for long-range communication on both 2.4GHz and 5GHz bands. It is ideal for applications requiring reliable wireless communication over extended distances (>10km), such as robotics, drones, and IoT deployments, ensuring robust performance in demanding environments.
The module integrates seamlessly with CRI’s R5165C SOM (Qualcomm QRB5165) via a PCIe M.2 E-Key interface. The driver is specifically designed for the QRB5165 and is fully compatible with the CRI R5165C SOM.
System on Module (SOM)
COREXOM R5165C Development Kit
CRI COREXOM R5165C SOM (System on Module) is a high-performance intelligent module, integrating Linux, based on Qualcomm QRB5165 processor. It integrates the advanced 7 nm FinFET process, a customized 64-bit Octa-core Qualcomm Kryo 585 applications processor.
R5165C SOM supports two 4-lanes MIPI-DSI, six 4-lanes MIPI-CSI integrates multiple audio and video input/output interfaces. It provides a variety of GPIO, I2C, UART and SPI standard interfaces. In addition, it supports together with SOM common standard protocol interfaces such as USB3.1, PCIE2.1/3.0 and I2S.
R5165C SOM provides convenient and stable system solution for IOT field, it can be embedded into the device on VR/AR, Robot, Smart Camera, AI devices, and any other connecting fields. The size of module is 90mm x 48mm x 10.17mm, besides a 240pins B2B connector.
System on Module (SOM)
COREXOM R5165C SOM
CRI COREXOM R5165C SOM (System on Module) is a high-performance intelligent module, integrating Linux, based on Qualcomm QRB5165 processor. It integrates the advanced 7 nm FinFET process, a customized 64-bit Octa-core Qualcomm Kryo 585 applications processor.
R5165C SOM supports two 4-lanes MIPI-DSI, six 4-lanes MIPI-CSI integrates multiple audio and video input/output interfaces. It provides a variety of GPIO, I2C, UART and SPI standard interfaces. In addition, it supports together with SOM common standard protocol interfaces such as USB3.1, PCIE2.1/3.0 and I2S.
R5165C SOM provides convenient and stable system solution for IOT field, it can be embedded into the device on VR/AR, Robot, Smart Camera, AI devices, and any other connecting fields. The size of module is 90mm x 48mm x 10.17mm, besides a 240pins B2B connector.