Overview
Features
- High-performance and power-efficient Qualcomm® QCS6490 SoC
- A combined AI performance of up to 12 TOPS
- Advanced ISPs for single or multiple concurrent camera experience with superior image and video capture
- Blazing-fast wireless connectivity and low latency thanks to multi-gigabit Wi-Fi 6E: Up to 3.6 Gbps, 160MHz, 4K QAM, DBS with MU-MIMO and OFDMA, and WPA3-P & E
- Superior Bluetooth® 5.2 and LE audio with crystal-clear sound, low latency, and reliability with an extended range
- Low-speed expansion for GPIOs, I2C, SPI, UART, and/or audio
- High-speed expansion for PCIe, USB, MIPI CSI/DSI, and/or SDIO.
Target Applications
- Face Detection and Recognition
- Deep Learning
- Inventory Management
- Surveillance and Security
- Object Detection and Avoidance
- Path Planning and 3D Map Formation
- vSLAM (Visual Localization and Mapping)
- Driver Management Systems
- Industrial Handheld and Tablet
- Point-of-sale Systems (POS) and Kiosk
- Industrial PC
Specifications
| Description | |
|---|---|
| Chipset | QCS6490 |
| Processor | Qualcomm® Kryo™ CPU 670, 1x Gold+@2.7 GHz + 3x Gold@2.4 GHz + 4x Silver @1.9 GHz, 2MB L3 |
| Memory (RAM) | 8GB LPDDR4x |
| Storage (onboard) | 128GB UFS Flash |
| Storage (external) | 1x MicroSD Card Slot, PCIe expansion for NVMe |
| AI Engine | 6th Gen Qualcomm AI Engine. Unlocking a combined AI performance of up to 12 TOPS/INT8 |
| GPU/VPU/DPU | Qualcomm® Adreno™ GPU 643 Adreno 633 VPU Adreno DPU 1075 |
| DSP | Qualcomm® Compute Hexagon™ DSP with dual HVX, Hexagon Co-processor (Hexagon CP) 2.0 and Hexagon Tensor Accelerator |
| ISP | Qualcomm® Spectra™ 570L image processing |
| Camera | 2x C-PHY/D-PHY 30-pin expansion ports on interposer board |
| Video | 4K@60FPS decode H.264/H.265/VP9 4K@30FPS encode H.264/H.265 |
| Display Interfaces | Up to two displays supported concurrently: Full-size HDMI connector, USB Type-C supporting DP alt mode, mini-DP connector, DSI expansion |
| WLAN/BT | 802.11ax with DBS, Bluetooth 5.2, two onboard printed antennas, RF expansion connectors for optional external antennas |
| PCIE | 1x PCIe Gen 3 2-lane to expansion connector, optional 1x PCIe Gen 3 1-lane to expansion connector |
| USB | 1x USB 3.0 Type-C, 1x USB 2.0 w/OTG, 2x USB 3.0 Type-A, 1x USB 3.0 on high-speed expansion |
| Audio | 1x DMIC, 2x digital audio amplifiers, I2S/Soundwire/DMIC expansion on low-speed connectors |
Resources
Documents
| Resources | Description | Link |
|---|---|---|
| Quick Start Guide | ||
Related Parts
SOM
| Part Number | Name | Description | Link |
|---|---|---|---|
 |
COREXOM R6490WGQ SOM | COREXOM R6490WGQ SOM, LGA, 8GB LPDDR4, 128GB UFS, WIFI 6E, BT, GPS | Link |
Development Kits
| Part Number | Name | Description | Link |
|---|---|---|---|
 |
Qualcomm® RB3 Gen 2 Development Kit (Vision Kit) | The Vision kit includes everything in the Core kit plus the Qualcomm Vision mezzanine board, a high-resolution main camera, and a low-resolution tracking camera. | Link |
Related products
Wireless Module
COREXOM I9074L Long Range WIFI Module
The CRI I9074L is a high-performance M.2 module providing Wi-Fi 6 connectivity for long-range communication on both 2.4GHz and 5GHz bands. It is ideal for applications requiring reliable wireless communication over extended distances (>10km), such as robotics, drones, and IoT deployments, ensuring robust performance in demanding environments.
The module integrates seamlessly with CRI’s R5165C SOM (Qualcomm QRB5165) via a PCIe M.2 E-Key interface. The driver is specifically designed for the QRB5165 and is fully compatible with the CRI R5165C SOM.
SOM Development Kits
Qualcomm® RB3 Gen 2 Development Kit (Core Kit)
The Qualcomm® RB3 Gen 2 development kit (Core Kit) gives developers a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases such as Robotics, industrial, and automation.
▪️Backorder available. ▪️Estimated shipping: End of December.
SOM Development Kits
Qualcomm® RB3 Gen 2 Development Kit (Vision Kit)
The Qualcomm® RB3 Gen 2 development kit (Vision Kit) gives developers a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases such as Robotics, industrial, and automation.
▪️Backorder available. ▪️Estimated shipping: End of December.
System on Module (SOM)
COREXOM R5165C Development Kit
CRI COREXOM R5165C SOM (System on Module) is a high-performance intelligent module, integrating Linux, based on Qualcomm QRB5165 processor. It integrates the advanced 7 nm FinFET process, a customized 64-bit Octa-core Qualcomm Kryo 585 applications processor.
R5165C SOM supports two 4-lanes MIPI-DSI, six 4-lanes MIPI-CSI integrates multiple audio and video input/output interfaces. It provides a variety of GPIO, I2C, UART and SPI standard interfaces. In addition, it supports together with SOM common standard protocol interfaces such as USB3.1, PCIE2.1/3.0 and I2S.
R5165C SOM provides convenient and stable system solution for IOT field, it can be embedded into the device on VR/AR, Robot, Smart Camera, AI devices, and any other connecting fields. The size of module is 90mm x 48mm x 10.17mm, besides a 240pins B2B connector.