Overview
Features
- High-performance and power-efficient Qualcomm® QCS6490 SoC
- A combined AI performance of up to 12 TOPS
- Advanced ISPs for single or multiple concurrent camera experience with superior image and video capture
- Blazing-fast wireless connectivity and low latency thanks to multi-gigabit Wi-Fi 6E: Up to 3.6 Gbps, 160MHz, 4K QAM, DBS with MU-MIMO and OFDMA, and WPA3-P & E
- Superior Bluetooth® 5.2 and LE audio with crystal-clear sound, low latency, and reliability with an extended range
- Low-speed expansion for GPIOs, I2C, SPI, UART, and/or audio
- High-speed expansion for PCIe, USB, MIPI CSI/DSI, and/or SDIO.
Target Applications
- Face Detection and Recognition
- Deep Learning
- Inventory Management
- Surveillance and Security
- Object Detection and Avoidance
- Path Planning and 3D Map Formation
- vSLAM (Visual Localization and Mapping)
- Driver Management Systems
- Industrial Handheld and Tablet
- Point-of-sale Systems (POS) and Kiosk
- Industrial PC
Specifications
| Description | |
|---|---|
| Chipset | QCS6490 |
| Processor | Qualcomm® Kryo™ CPU 670, 1x Gold+@2.7 GHz + 3x Gold@2.4 GHz + 4x Silver @1.9 GHz, 2MB L3 |
| Memory (RAM) | 8GB LPDDR4x |
| Storage (onboard) | 128GB UFS Flash |
| Storage (external) | 1x MicroSD Card Slot, PCIe expansion for NVMe |
| AI Engine | 6th Gen Qualcomm AI Engine. Unlocking a combined AI performance of up to 12 TOPS/INT8 |
| GPU/VPU/DPU | Qualcomm® Adreno™ GPU 643 Adreno 633 VPU Adreno DPU 1075 |
| DSP | Qualcomm® Compute Hexagon™ DSP with dual HVX, Hexagon Co-processor (Hexagon CP) 2.0 and Hexagon Tensor Accelerator |
| ISP | Qualcomm® Spectra™ 570L image processing |
| Camera | 2x C-PHY/D-PHY 30-pin expansion ports on interposer board |
| Video | 4K@60FPS decode H.264/H.265/VP9 4K@30FPS encode H.264/H.265 |
| Display Interfaces | Up to two displays supported concurrently: Full-size HDMI connector, USB Type-C supporting DP alt mode, mini-DP connector, DSI expansion |
| WLAN/BT | 802.11ax with DBS, Bluetooth 5.2, two onboard printed antennas, RF expansion connectors for optional external antennas |
| PCIE | 1x PCIe Gen 3 2-lane to expansion connector, optional 1x PCIe Gen 3 1-lane to expansion connector |
| USB | 1x USB 3.0 Type-C, 1x USB 2.0 w/OTG, 2x USB 3.0 Type-A, 1x USB 3.0 on high-speed expansion |
| Audio | 1x DMIC, 2x digital audio amplifiers, I2S/Soundwire/DMIC expansion on low-speed connectors |
Resources
Documents
| Resources | Description | Link |
|---|---|---|
| Quick Start Guide | ||
Related Parts
SOM
| Part Number | Name | Description | Link |
|---|---|---|---|
 |
COREXOM R6490WGQ SOM | COREXOM R6490WGQ SOM, LGA, 8GB LPDDR4, 128GB UFS, WIFI 6E, BT, GPS | Link |
Development Kits
| Part Number | Name | Description | Link |
|---|---|---|---|
 |
Qualcomm® RB3 Gen 2 Development Kit (Vision Kit) | The Vision kit includes everything in the Core kit plus the Qualcomm Vision mezzanine board, a high-resolution main camera, and a low-resolution tracking camera. | Link |
Related products
SOM Development Kits
SOM Development Kits
COREXOM R405LQ Long Range WIFI Evaluation Kit
CRI R405LQ LR EVA KIT is major packed with a R405LQ LR module, Antenna Kit (frame with 4 pcs Dipole Antenna) and accessories (cables and adaptor), through USB or UART connection to work similar as external WiFi network module. The R405LQ can support RNDIS (Remote Network Driver Interface Specification) standard as module interface control. The R405LQ LR is leverage WiFi technology, and capable for long distances connection and data communication.
When using R405LQ LR to build up connection network, please need to set up one of R405LQ LR as AP mode (default), and others R405LQ LR are set as STA (Cline) mode. They are communicate working in closed network areas.
System on Module (SOM)
COREXOM R6490WGQ SOM
Presenting the COREXOM R6490WGQ SOM – powered by the Qualcomm® QCS6490 system-on-chip. Featuring the potent Qualcomm® Kryo™ 670 CPU and a fused AI-accelerator architecture within the Qualcomm® Hexagon processor, this solution impressively combines exceptional computational power with remarkable energy efficiency. Boasting support for up to five MIPI CSI interfaces, dynamic triple ISPs, seamless 4K@60FPS video decoding, and 4K@30FPS video encoding, as well as a comprehensive array of external interfaces like GPIO, UART, I2C, I3C, SPI, DSI, USB 3.1, and PCIe, the R6490WGQ SOM has been enhanced to include GPS and Wi-Fi 6E/Bluetooth features.
Furthermore, it supports Android, Ubuntu, Linux, and Windows 11 IoT Enterprise operating systems. This System-on-Chip is designed for developers aiming to reduce design complexity and achieve a faster time to market, making it an ideal choice for industrial and commercial IoT applications. From ruggedized handhelds and tablets to kiosks, AI cameras, and point-of-sale systems, the COREXOM R6490WGQ SOM provides a comprehensive solution that empowers developers to streamline their designs and bring innovative products to market efficiently.
SOM Development Kits
IMX577 Camera Module Kit for Qualcomm RB3 Gen 2 Dev. Kit
This IMX577 Camera Module Kit is designed for seamless integration with the Qualcomm RB3 Gen 2 Development Kit. It includes the high-performance 12MP Sony IMX577 image sensor, a flexible flat cable (FFC), and an adapter board for easy plug-and-play connectivity. Ideal for developers working on embedded vision, robotics, or AI edge applications, this kit enables high-quality image capture with minimal setup effort.