COREXOM R5165C SOM
CRI COREXOM R5165C SOM (System on Module) is a high-performance intelligent module, integrating Linux, based on Qualcomm QRB5165 processor. It integrates the advanced 7 nm FinFET process, a customized 64-bit Octa-core Qualcomm Kryo 585 applications processor.
R5165C SOM supports two 4-lanes MIPI-DSI, six 4-lanes MIPI-CSI integrates multiple audio and video input/output interfaces. It provides a variety of GPIO, I2C, UART and SPI standard interfaces. In addition, it supports together with SOM common standard protocol interfaces such as USB3.1, PCIE2.1/3.0 and I2S.
R5165C SOM provides convenient and stable system solution for IOT field, it can be embedded into the device on VR/AR, Robot, Smart Camera, AI devices, and any other connecting fields. The size of module is 90mm x 48mm x 10.17mm, besides a 240pins B2B connector.
Overview
Features
- Qualcomm® SnapdragonTM 7nm QRB5165 SoC
- A combined AI performance of up to 15 TOPS
- Memory with LPDDR5(POP) 8GB + UFS3.0 128GB
- Two MIPI-DSI 4-lane, 5040 x 2160@60fps
- Six MIPI-CSIs 4-lane
- 2x USB 3.1 GEN2
- 2x 2-lane PCIe Gen3.0
- Support for Linux Ubuntu operating systems
Applications
- Human Machine Interface System
- Drone and ROV
- Embedded Vision and AI Camera
- Service Robot
Specifications
COREXOM R5165C SOM Specifications
| Item | Description |
|---|---|
| Processor | SnapdragonTM QRB5165 |
| Memory | LPDDR5(POP) 8GB + UFS3.0 128GB |
| Display I/F | 2x MIPI-DSI 4-lane, 5040 x 2160@60fps |
| Camera I/F | 6x 4 data lane MIPI CSI |
| Audio I/F | SoundWire interface for codec
SoundWire interface for smart speaker amplifier 3x MI2S with two data lanes to support full duplex stereo 1x MI2S with four data lanes for up to eight channels 3x DMIC ports support up to 6 DMICs |
| USB | 2x USB 3.1 GEN2 |
| PCIe | 2x 2-lane PCIe Gen3.0 |
| Peripheral (QUP) I/F | 1x UART, 1x SDC for SD card,
11x 4pin QUPs (can be set as 4-pin SPI or 2-pin I2C) 2x QUPs can be set as 2pin I2C 4x camera dedicated I2C 2x sensor dedicated I2C 1x sensor dedicated SPI |
| Connectivity | Through PCIe (over M.2) to access external WiFi and BT features
Through 240P BTB connector to extend IO features. |
Related products
SOM Development Kits
Qualcomm® RB3 Gen 2 Development Kit (Vision Kit)
The Qualcomm® RB3 Gen 2 development kit (Vision Kit) gives developers a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases such as Robotics, industrial, and automation.
SOM Development Kits
SOM Development Kits
COREXOM R405LQ Long Range WIFI Evaluation Kit
CRI R405LQ LR EVA KIT is major packed with a R405LQ LR module, Antenna Kit (frame with 4 pcs Dipole Antenna) and accessories (cables and adaptor), through USB or UART connection to work similar as external WiFi network module. The R405LQ can support RNDIS (Remote Network Driver Interface Specification) standard as module interface control. The R405LQ LR is leverage WiFi technology, and capable for long distances connection and data communication.
When using R405LQ LR to build up connection network, please need to set up one of R405LQ LR as AP mode (default), and others R405LQ LR are set as STA (Cline) mode. They are communicate working in closed network areas.
System on Module (SOM)
COREXOM R5165C Development Kit
CRI COREXOM R5165C SOM (System on Module) is a high-performance intelligent module, integrating Linux, based on Qualcomm QRB5165 processor. It integrates the advanced 7 nm FinFET process, a customized 64-bit Octa-core Qualcomm Kryo 585 applications processor.
R5165C SOM supports two 4-lanes MIPI-DSI, six 4-lanes MIPI-CSI integrates multiple audio and video input/output interfaces. It provides a variety of GPIO, I2C, UART and SPI standard interfaces. In addition, it supports together with SOM common standard protocol interfaces such as USB3.1, PCIE2.1/3.0 and I2S.
R5165C SOM provides convenient and stable system solution for IOT field, it can be embedded into the device on VR/AR, Robot, Smart Camera, AI devices, and any other connecting fields. The size of module is 90mm x 48mm x 10.17mm, besides a 240pins B2B connector.