This IMX577 Camera Module Kit is designed for seamless integration with the Qualcomm RB3 Gen 2 Development Kit. It includes the high-performance 12MP Sony IMX577 image sensor, a flexible flat cable (FFC), and an adapter board for easy plug-and-play connectivity. Ideal for developers working on embedded vision, robotics, or AI edge applications, this kit enables high-quality image capture with minimal setup effort.
IMX577 Camera Module Kit for Qualcomm RB3 Gen 2 Dev. Kit
$149.00
This IMX577 Camera Module Kit is designed for seamless integration with the Qualcomm RB3 Gen 2 Development Kit. It includes the high-performance 12MP Sony IMX577 image sensor, a flexible flat cable (FFC), and an adapter board for easy plug-and-play connectivity. Ideal for developers working on embedded vision, robotics, or AI edge applications, this kit enables high-quality image capture with minimal setup effort.
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SOM Development Kits
Qualcomm® RB3 Gen 2 Development Kit (Core Kit)
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The Qualcomm® RB3 Gen 2 development kit (Core Kit) gives developers a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases such as Robotics, industrial, and automation.
▪️Backorder available. ▪️Estimated shipping: End of December.
System on Module (SOM)
COREXOM R5165C Development Kit
CRI COREXOM R5165C SOM (System on Module) is a high-performance intelligent module, integrating Linux, based on Qualcomm QRB5165 processor. It integrates the advanced 7 nm FinFET process, a customized 64-bit Octa-core Qualcomm Kryo 585 applications processor.
R5165C SOM supports two 4-lanes MIPI-DSI, six 4-lanes MIPI-CSI integrates multiple audio and video input/output interfaces. It provides a variety of GPIO, I2C, UART and SPI standard interfaces. In addition, it supports together with SOM common standard protocol interfaces such as USB3.1, PCIE2.1/3.0 and I2S.
R5165C SOM provides convenient and stable system solution for IOT field, it can be embedded into the device on VR/AR, Robot, Smart Camera, AI devices, and any other connecting fields. The size of module is 90mm x 48mm x 10.17mm, besides a 240pins B2B connector.













