Qualcomm® RB3 Gen 2 Development Kit (Core Kit)
$399.00
The Qualcomm® RB3 Gen 2 development kit (Core Kit) gives developers a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases such as Robotics, industrial, and automation.
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Features
- High-performance and power-efficient Qualcomm® QCS6490 SoC
- A combined AI performance of up to 12 TOPS
- Advanced ISPs for single or multiple concurrent camera experience with superior image and video capture
- Blazing-fast wireless connectivity and low latency thanks to multi-gigabit Wi-Fi 6E: Up to 3.6 Gbps, 160MHz, 4K QAM, DBS with MU-MIMO and OFDMA, and WPA3-P & E
- Superior Bluetooth® 5.2 and LE audio with crystal-clear sound, low latency, and reliability with an extended range
- Low-speed expansion for GPIOs, I2C, SPI, UART, and/or audio
- High-speed expansion for PCIe, USB, MIPI CSI/DSI, and/or SDIO, designed for 96Boards mezzanines
Target Applications
- Face Detection and Recognition
- Deep Learning
- Inventory Management
- Surveillance and Security
- Object Detection and Avoidance
- Path Planning and 3D Map Formation
- vSLAM (Visual Localization and Mapping)
- Driver Management Systems
- Industrial Handheld and Tablet
- Point-of-sale Systems (POS) and Kiosk
- Industrial PC
Block Diagram
Qualcomm RB3 Gen 2 Development Kit (Core Kit)
Development Kit (Core Kit) Contents
The Core kit includes essential components, featuring the Qualcomm QCS6490 system-on-module (SoM) mounted to the mainboard through an interposer board.
- Qualcomm RB3 Gen 2 mainboard
- QCS6490 SoM + interposer
- Power supply (12 V)
- USB-A to USB-C cable
- Two speakers
- Pick tool to help access DIP switches
Software
- Support for Linux, Android
- Qualcomm® Intelligent Multimedia Product SDK (for Linux)
- Qualcomm® Intelligent Robotics Product SDK
- Qualcomm® Neural Processing SDK
- Hexagon SDK
Highlight
On board artificial intelligence
The onboard artificial intelligence, powered by the Qualcomm® AI Engine boasting 12 TOPs of processing power, enhances on-device AI capabilities significantly. This results in swifter execution of AI algorithms, elevating user experiences, and optimizing power consumption effectively.
Performance
Utilizing the QCS6490 SoC, featuring an Octa-core CPU (clocked up to 2.7 GHz) and Adreno 643 GPU, offers notable performance benefits across diverse applications. Moreover, it guarantees enduring reliability with extended product support extending until 2036. Its efficient processing empowers real-time decision-making and precise control in robotics, presenting a potent and future-ready solution.
Expansion connectors
The development kit provides access to multiple I/O interfaces on the SoCs via standard expansion connectors. High-speed connectors, such as PCIE and MIPI CSI, enable effortless integration with high-data rate peripheral devices. Low-speed connectors offer GPIOs, UART, SPI, I2C, I2S, and additional options, ensuring versatility in interface connections. Simplify development, foster innovation, and expedite project progress effortlessly.
Scalable hardware architecture
The development kit provides flexibility through optional mezzanine boards with passthrough connectors. Developers can easily create prototypes by stacking additional mezzanine boards, enhancing functionality with features like 5G connectivity, extra sensors, cameras, and beyond. The Vision Mezzanine follows the same stacked architecture and includes additional MIPI CSI and GMSL camera connectors for enhanced vision applications.
Pre-integrated with Multiple Sensors
The dev kit comes with pre-integrated sensors and drivers for camera and motor control functions, ensuring convenience and ease of use without requiring additional integration efforts. A dedicated DSP, shared between the sensor core and low-power audio subsystem, enhances performance and efficiency, making it particularly suitable for IoT applications demanding audio processing capabilities.)
Software support
The development kit comes equipped with Qualcomm® Linux® preloaded, offering developers access to additional SDKs supporting cross-compile toolchains, robotics algorithms, TensorFlow Lite, GStreamer plugins, and middleware such as the Robot Operating System (ROS).
Connectivity
802.11ax offers faster and more reliable Wi-Fi connections, ensuring seamless communication with other devices and networks. Bluetooth 5.2 enhances range, speed, and data transfer capabilities, facilitating efficient wireless communication between your device and peripherals.
Camera and computer vision
Supporting a 22Mp camera and accommodating up to 3 concurrent cameras, this platform provides developers with ample opportunities for computer vision applications. From high-resolution image processing to multi-camera configurations, it enables the creation of innovative solutions for surveillance, object recognition, augmented reality, and beyond, pushing the limits of computer vision technology.
Specifications
| Description | |
|---|---|
| Chipset | QCS6490 |
| Processor | Qualcomm® Kryo™ CPU 670, 1x Gold+@2.7 GHz + 3x Gold@2.4 GHz + 4x Silver @1.9 GHz, 2MB L3 |
| Memory (RAM) | 8GB LPDDR4x |
| Storage (onboard) | 128GB UFS Flash |
| Storage (external) | 1x MicroSD Card Slot, PCIe expansion for NVMe |
| AI Engine | 6th Gen Qualcomm AI Engine. Unlocking a combined AI performance of up to 12 TOPS/INT8 |
| GPU/VPU/DPU | Qualcomm® Adreno™ GPU 643 Adreno 633 VPU Adreno DPU 1075 |
| DSP | Qualcomm® Compute Hexagon™ DSP with dual HVX, Hexagon Co-processor (Hexagon CP) 2.0 and Hexagon Tensor Accelerator |
| ISP | Qualcomm® Spectra™ 570L image processing |
| Camera | 2x C-PHY/D-PHY 30-pin expansion ports on interposer board |
| Video | 4K@60FPS decode H.264/H.265/VP9 4K@30FPS encode H.264/H.265 |
| Display Interfaces | Up to two displays supported concurrently: Full-size HDMI connector, USB Type-C supporting DP alt mode, mini-DP connector, DSI expansion |
| WLAN/BT | 802.11ax with DBS, Bluetooth 5.2, two onboard printed antennas, RF expansion connectors for optional external antennas |
| PCIE | 1x PCIe Gen 3 2-lane to expansion connector, optional 1x PCIe Gen 3 1-lane to expansion connector |
| USB | 1x USB 3.0 Type-C, 1x USB 2.0 w/OTG, 2x USB 3.0 Type-A, 1x USB 3.0 on high-speed expansion |
| Audio | 1x DMIC, 2x digital audio amplifiers, I2S/Soundwire/DMIC expansion on low-speed connectors |
| Sensor | IMU onboard (ICM-42688), additional expansion |
Resources
Documents
| Resources | Description | Link |
|---|---|---|
| Qualcomm® RB3 Gen 2 Quick Start Guide | This Quick Start Guide is intended for setting up the Qualcomm® RB3 Gen 2 Development Kit to experience end-to-end multimedia and artificial intelligence (AI) applications in a Linux-based environment. Additionally, this guide provides instructions for establishing essential communication with the Linux host. | Link |
| Qualcomm® RB3 Gen 2 Development Kit Guide | This document provides an overview of the Qualcomm® RB3 Gen 2 Development Kit hardware connectors, DIP switches, and GPIOs. It is a reference for all users. | Link |
Related Parts
SOM
| Part Number | Name | Description | Link |
|---|---|---|---|
 |
COREXOM R6490WGQ SOM | COREXOM R6490WGQ SOM, LGA, 8GB LPDDR4, 128GB UFS, WIFI 6E, BT, GPS | Link |
SOM on Interposer
| Part Number | Name | Description | Link |
|---|---|---|---|
 |
COREXOM R6490WGQ interposer | COREXOM R6490WGQ SOM, 500 Pin interposer |
Development Kits
| Part Number | Name | Description | Link |
|---|---|---|---|
 |
Qualcomm® RB3 Gen 2 Development Kit (Vision Kit) | The Vision kit includes everything in the Core kit plus the Qualcomm Vision mezzanine board, a high-resolution main camera, and a low-resolution tracking camera. | Link |
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